Welcome!
The 2010 National Space & Missile Materials Symposium (NSMMS) brings together the Nation’s technology leaders to review the critical challenges of materials, processing, and manufacturing for space, missile, and hypersonic systems. Nearly 500 system engineers, designers, scientists, researchers, managers, and senior leaders attend from the joint services, NASA, DOE, academia, and industry. The Symposium has established a format that focuses on key materials and processing challenges associated with system and component needs on the critical path to enabling current and future capabilities. The NSMMS maintains this focus to directly convey to a diverse audience of researchers, planners, managers, and senior leadership the importance of supporting advanced materials technology development. Advanced materials are crucial to the improved performance and reliability of both commercial and defense systems. As a national materials community, it is important to establish and continue an exchange with our leaders emphasizing that advanced materials research must be a priority for the country.
New for 2010!
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Hypersonic & Responsive Operations Session
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Materials on the International Space Station Experiments Session
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SBIR Poster Session with One-on-One Meetings
2010 Forum
The 2010 Forum will have a senior level plenary session, multiple technical sessions, tutorials, workshops, poster papers, and networking events. We are soliciting abstracts for presentations that address key material and processing issues facing our space and missile systems, as discussed above and associated with the topic areas addressed under the topic description section of this announcement.
ITAR Restricted
This Symposium is restricted to US CITIZENS ONLY and is ITAR Restricted in accordance with DoD directive 5230.5 under the provisions of Public Law 98-94, “Department of Defense Authorization Act, 1984,” Section 1217, Sept 24, 1983. This conference is not open to the general public. Presentations may not be more restrictive than Distribution C. Please visit the security page for more information. |